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  avago technologies - 1 - description the avago technologies ACFM-7024 is a quadplexer that combines lte band 2 and band 4 duplexers into a single, miniature package. the ACFM-7024 features a single antenna connection, which eliminates the need for ante nna switching. all ports are matched to 50 ohms. the ACFM-7024 is designed with avago technologies film bulk acoustic resonator (fbar) technology. the ACFM-7024 also utilizes avago technologies innovative microcap bonded-wafer, chip scale packaging technology. this process allows the filters to be assembled in a module with a footprint of only 3.6 mm 2 mm with a maximum height of 0.80 mm. low tx insertion loss of the ACFM-7024 reduces power amplifier current, which extends the battery life. the ACFM-7024 enhances receiver sensitivity and dynamic range with low rx insertion loss and high rejection of tx signals at the rx ports. the excellent power handling capability of avago technologies fbar bulk-mode resonators supports the high tx output power levels needed mo bile communications devices while adding virtually no distortion. features ? single antenna ? band 2 and band 4 carrier aggregation ? miniature size 3.6 mm 2 mm footprint 0.80 mm maximum height ? environmental rohs 6 compliant halogen free tbbpa free ? high power rating +31 dbm maximum tx power applications smartphones, tablets, and mo bile/portable communications devices operating in bands 2 and 4. functional block diagram ordering information part number number of devices container ACFM-7024-blk 100 tape strip or gel-pack ACFM-7024-tr1 3000 178 mm (7-inch) reel #boe5y 1psu 1jo
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#boe %vqmfyfs #boe %vqmfyfs ACFM-7024 band 2/band 4 quadplexer product brief
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. all other brand and product names may be trademarks of their respective companies. data subject to change. copyright ? 2015 avago technologies. all rights reserved. av02-4921en C 2015-05-01 package dimensions and marking specification pin description pin connection 1band 4 rx 4band 2 rx 8band 4 tx 11 band 2 tx 13 ant 2, 3, 5, 6, 7, 9, 10, 12, 14, 15 gnd 1.600 x 0.750 0.25 x 45 chamfer 0.400 x 0.255 (14x) 0.515 1.545 0.750 3.000 1.500 0.7725 0.750 0.05 2.000 0.075 ant b2 rx 3.600 0.075 b2 tx b4 tx b4 rx pin 1 mark oxide layer (see notes) 1 14 13 12 11 10 9 87 15 2 3 4 5 6 bfiyww ddxxxx vago notes: 1. dimensions in millimeters 2. tolerance, unless otherwise noted: x.xx 0.05 mm x.xxx 0.025 mm 3. dimensions nominal unless otherwise noted 4. angles 45 nominal 5. contact areas are gold plated 6. metal gnd and i/o pads are solder mask defined by means of a thin (< 1m) oxide layer top view bottom view side view package marking code: avago = avago technologies, inc. b = ACFM-7024 f = fbar technology i = assembly id y = year (last digit) ww = work week dd = date code xxxx = production lot


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